Description
The single crystalline silicon wafers are sliced by wire saw machinesOptions
| Parameter | Specification | |
| Pseudosquare's side, mm |
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| Corner between pseudosquare's side, degree |
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| Difference between max. and min. size of arcs of pseudusquare: not more then, mm |
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| Wafers thickness, mkm |
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| TTV, not more then, mkm |
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| BOW, not more then, mkm |
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| Edge defects, not more then |
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